| 摘要 |
The switch (7) includes a number of modules (1) distributed along a cooling conduit (8) through which flows a cooling liquid (5). Each module includes a number of semiconductor components (2) placed on a substrate (3) presenting a base (4). The base is in direct contact with a cooling element (6) connected to the cooling conduit. The semiconductor components and their substrate are encapsulated into a resin block.
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