| 摘要 |
PROBLEM TO BE SOLVED: To see to it that physical stresses do not add to a substrate or a cooling element so as to prevent the occurrence of cracks by forming a first wiring pattern to a semiconductor laser on one face of a substrate, and by forming a second wiring pattern to a cooling element at the other face of the substrate. SOLUTION: A semiconductor laser 21 is attached to a heat sink 23 through a mount element 22, and it is attached by brazing or the like to the topside of a ceramic substrate 24. On the other hand, several heat-absorbing faces 26a of a plurality of cooling elements 26 are connected in series electrically to the bottom of the ceramic substrate 24. Furthermore, a first wiring pattern is made on one face of the ceramic substrate 24, and a second wiring pattern to the several heat-absorbing faces 26a of several cooling elements 26 is made at the other face. Thereby, physical stress does not add to the ceramic substrate 24 or the cooling element 26, and the occurrence of cracks can be prevented, and the downsizing can be promoted. |
