| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated board for low dielectric constant printed circuit that can be manufactured by the same facility as that of a conventional glass epoxy copper-clad laminated board, has improved matching property, is less expensive, and is suited for forming a high-speed and high-frequency circuit, a prepreg for laminated board, and a low dielectric constant resin composition. SOLUTION: A laminated board for low dielectric constant printed circuit that is formed in one piece by heating and pressurizing by using a prepreg for laminated board, where a low dielectric constant resin composition with an epoxy resin whit dicyclopentadienyl framework (A) and bisphenol A dicyanate resin in that an equivalent weight ratio of 20-50% of cyanate group is subjected to trimerization treatment in advance (B) as essential constituents is applied, impregnated, and dried for a fiber base as an insulation layer, a low dielectric constant resin composition, and a prepreg for laminated board are provided. |
