MOUNTING STRUCTURE OF FUNCTIONAL ELEMENT AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a mounting and manufacturing method dealing with warpage deformation of a circuit board regarding a mounting structure which is composed of a semiconductor device mounted on the circuit board. SOLUTION: In a gap between a semiconductor device and circuit board 3 on a part of its planar region, a hardening-shrinkable resin 5 which has a high shrinkage at hardening and is different from an encapsulating resin 4 in rapid hardening property is applied as spots, and the encapsulating resin 4 is filled in the gap to form a mounting structure. If the circuit board warps, connections between all electrodes on both electrode forming planes are ensured and by the shrinkage of the hardening-shrinkable resin 5 and integrated by the encapsulating resin 4.