| 摘要 |
PROBLEM TO BE SOLVED: To provide a green sheet manufacturing method, in which a highly reliable fine pattern having a high aspect ratio is formed directly on a backing without executing photosensitive paste applying processes and the pattern is transferred to a green sheet, a device for manufacturing a backing with pattern for transfer, and a manufacturing method through which a highly reliable high- density ceramic multilayer printed wiring board can be manufactured by using the green sheet. SOLUTION: A circuit pattern is formed on a green sheet, by putting photosensitive paste 3 in a container 2 and forming a pattern having a high aspect ratio on a backing through an optical molding method in which active energy 4 is projected through an exposure window 21, and then transferring the pattern to the green sheet. Then a multilayer printed wiring ceramic board is manufactured by laminating green sheets carrying circuit patterns upon another and sintering the laminated green sheets. |
