| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has excellent moisture resistance and excellent solder heat resistance after dipped in a high melting point solder bath, does not generate the inner cracks of the resin and the release of the sealed resin from a semiconductor device or a lead frame, and can guarantee the good reliability for a long period, and to provide a semiconductor-sealed device. SOLUTION: This epoxy resin composition contains (A) a highly pure phenolic resin which has a softening temperature of 60 to 90 deg.C, a weight-average mol.wt. of >=1,000, and has methylol groups, wherein the water extract of a cured molded product of the phenolic resin alone has a conductivity of <=100μs/cm, (B) an epoxy resin, (C) a curing accelerator, and (D) an inorganic filler as essential components. The inorganic filler D is preferably contained in an amount of 25 to 93 wt.% based on the total amount of the resin composition. The semiconductor-sealed device comprises a semiconductor chip sealed with the cured product of the resin composition.
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