| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject resin paste excellent in bond strength and a long pot life, by including a liquid epoxy resin, a phenol curing agent, a latent curing agent, a silane compound, an organic borate and an inorganic filler. SOLUTION: This paste comprises (A) 100 pts.wt. of a liquid epoxy resin composed of a liquid epoxy resin of formula I (m+n>=2) and an epoxy group- containing reactive diluent (e.g. styrene oxide, etc.), in the weight ratio of 70:30-100:0, (B) 20-60 pts.wt. of a phenol curing agent (e.g. bis phenol F etc.), (C) 0.5-5 pts.wt. of a latent curing agent (e.g. dicyandiamide etc.), (D) 10-60 pts.wt. based on 100 pts.wt. of the total of the components A, B and C of a silane compound (e.g. γ-glycidoxypropyltrimethoxysilane, etc.), of formula II (R1 is an epoxy group-containing aliphatic group; R2 is an alkoxy; R3 is an alkyl or the like), (E) 0.5-10 pts.wt. of an organic borate (tetraphenylphosphonium tetraphenyl borate) and (F) an inorganic filler (e.g. silver powder). |
