| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper-metallized film suitable for a flexible printed wiring board suitable for a fine processing and/or COF mounting and its production method and to provide a copper-metallized film having flexibility and folding resistance at least equivalent to rolled copper foil and its production method. SOLUTION: In the copper-metallized film, a copper layer and/or a copper alloy layer are/is formed on an insulation film. The cross sections of the copper layer and/or the copper alloy layer of the copper-metallized film are made a cross-sectional layer in which at least 25% of crystals of at least 1μm in crystal particle size exist. In the production method, in the copper-metallized film, a thin metal film layer is formed as required on the surface of the insulation film, the copper layer and/or the copper alloy layer are formed on the thin metal film layer by copper electroplating or copper alloy electroplating, and the cross sections of the copper layer and/or the copper alloy layer are formed into the cross-sectional layer in which at least 25% of the crystals of at least 1μm in crystal particle size exist. COPYRIGHT: (C)2006,JPO&NCIPI
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