发明名称 |
CONTROLLING PASSIVATING FILM PROPERTIES USING COLLOIDAL PARTICLES POLYELECTROLYTES, AND IONIC ADDITIVES FOR COPPER CHEMICAL MECHANICAL PLANARIZATION |
摘要 |
The present invention provides for a copper CMP slurry composition which comprises a complexing agent, an oxidizer, an abrasive and a passivating agent. The present invention also provides for a method of chemical mechanical planarization of a copper conductive structure which comprises administering the copper CMP slurry composition during the planarization process. |
申请公布号 |
WO2008157293(A1) |
申请公布日期 |
2008.12.24 |
申请号 |
WO2008US66837 |
申请日期 |
2008.06.13 |
申请人 |
ST. LAWRENCE NANOTECHNOLOGY, INC.;LI, YUZHUO |
发明人 |
LI, YUZHUO |
分类号 |
C09C1/68;C09K3/14 |
主分类号 |
C09C1/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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