发明名称 |
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same |
摘要 |
A ball-limiting metallurgy (BLM) stack is provided for an electrical device. The BLM stack resists tin migration toward the metallization of the device. A solder system is also provided that includes a eutectic-Pb solder on a substrate that is mated to a high-Pb solder, and that withstands higher temperature reflows and other higher temperature processes.
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申请公布号 |
US2007004086(A1) |
申请公布日期 |
2007.01.04 |
申请号 |
US20050173238 |
申请日期 |
2005.06.30 |
申请人 |
HUA FAY;WU ALBERT T;JENG KEVIN;SESHAN KRISHNA |
发明人 |
HUA FAY;WU ALBERT T.;JENG KEVIN;SESHAN KRISHNA |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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