发明名称 |
WAFER MANUFACTURING METHOD, POLISHING APPARATUS, AND WAFER |
摘要 |
The present invention provides a wafer manufacturing method and a wafer polishing apparatus which enable control of sags in a periphery of a wafer and improvement of nanotopology values thereof that is strongly required recently, and a wafer. In a polishing process for making a mirror surface of the wafer, a back surface of the wafer is polished to produce a reference plane thereof.
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申请公布号 |
US2009057840(A1) |
申请公布日期 |
2009.03.05 |
申请号 |
US20080263867 |
申请日期 |
2008.11.03 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
NETSU SHIGEYOSHI;MASUMURA HISASHI |
分类号 |
H01L23/00;H01L21/302;H01L21/306 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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