| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor sealing sheet presenting a cured product having highly tight adhesiveness, high heat resistance and light resistance, and to provide an optical semiconductor element using the same. <P>SOLUTION: The optical semiconductor sealing sheet comprises a sealing sheet composition comprising a silicone resin A, liquid at 25°C and having cyclic ether-containing groups in molecules, a heat curing agent reacting with the cyclic ether-containing groups, and a silicone resin B having 30-150°C softening point. <P>COPYRIGHT: (C)2009,JPO&INPIT |
