Multilayer, thermally-stabilized substrate structures

摘要

A multilayer, thermally-stabilized substrate, including a thermally-conductive core structure (108), including a central section (112) located horizontally between two edge sections (114); a top multilayer circuit board (110) connected to the top surface of the central portion of the core structure; and a bottom multilayer circuit board (110) connected to the bottom surface of the central portion of the core structure. The core structure (108) has a core thermal conductance and a effective core horizontal thermal expansion coefficient. The top and bottom multilayer circuit boards (110) each include at least one dielectric layer (104) and at least one electrically-conductive layer (106), and each have a circuit board thermal conductance that is less than the core thermal conductance of the core structure. The electrically-conductive layers of the top and the bottom circuit boards each have a conductive layer horizontal thermal expansion coefficient that is less than or equal to the effective core horizontal thermal expansion coefficient of the core structure.