发明名称 |
Liquid ejecting head, liquid ejecting apparatus, and method for manufacturing liquid ejecting head |
摘要 |
A liquid ejecting head includes a nozzle opening that is formed on one face of a silicon substrate, and ejects liquid, a first concave portion that is provided on the other face of the silicon substrate, and configures a pressure generating chamber which communicates with the nozzle opening, and a second concave portion that is provided on one face of the silicon substrate, and configures a flow path which communicates with the first concave portion and supplies the liquid, in which the first concave portion and the second concave portion overlap each other in an in-plane direction when seen in a direction which is orthogonal to the face of the silicon substrate. |
申请公布号 |
US9358784(B2) |
申请公布日期 |
2016.06.07 |
申请号 |
US201514678317 |
申请日期 |
2015.04.03 |
申请人 |
Seiko Epson Corporation |
发明人 |
Oya Kazufumi |
分类号 |
B41J2/045;B41J2/14;B41J2/16 |
主分类号 |
B41J2/045 |
代理机构 |
Harness, Dickey & Pierce, P.L.C. |
代理人 |
Harness, Dickey & Pierce, P.L.C. |
主权项 |
1. A liquid ejecting head comprising:
a nozzle opening that is formed on one face of a silicon substrate, and ejects liquid; a first concave portion that is provided on the other face of the silicon substrate, and configures a pressure generating chamber which communicates with the nozzle opening; a second concave portion that is provided on one face of the silicon substrate, and configures a flow path which communicates with the first concave portion and supplies the liquid; a vibration plate that seals the first concave portion, and generates pressure within the pressure generating chamber, on the other face of the silicon substrate; and a sealing plate that seals the second concave portion, and configures a portion of a wall face of the flow path, on one face of the silicon substrate, wherein the first concave portion and the second concave portion overlap each other in an in-plane direction when seen in a direction which is orthogonal to the face of the silicon substrate, a stepped concave portion which accommodates the sealing plate, and of which a depth is larger than a thickness of the sealing plate, is provided on one face of the silicon substrate, and the second concave portion is placed on an inside of the stepped concave portion. |
地址 |
JP |