发明名称 Liquid ejecting head, liquid ejecting apparatus, and method for manufacturing liquid ejecting head
摘要 A liquid ejecting head includes a nozzle opening that is formed on one face of a silicon substrate, and ejects liquid, a first concave portion that is provided on the other face of the silicon substrate, and configures a pressure generating chamber which communicates with the nozzle opening, and a second concave portion that is provided on one face of the silicon substrate, and configures a flow path which communicates with the first concave portion and supplies the liquid, in which the first concave portion and the second concave portion overlap each other in an in-plane direction when seen in a direction which is orthogonal to the face of the silicon substrate.
申请公布号 US9358784(B2) 申请公布日期 2016.06.07
申请号 US201514678317 申请日期 2015.04.03
申请人 Seiko Epson Corporation 发明人 Oya Kazufumi
分类号 B41J2/045;B41J2/14;B41J2/16 主分类号 B41J2/045
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. A liquid ejecting head comprising: a nozzle opening that is formed on one face of a silicon substrate, and ejects liquid; a first concave portion that is provided on the other face of the silicon substrate, and configures a pressure generating chamber which communicates with the nozzle opening; a second concave portion that is provided on one face of the silicon substrate, and configures a flow path which communicates with the first concave portion and supplies the liquid; a vibration plate that seals the first concave portion, and generates pressure within the pressure generating chamber, on the other face of the silicon substrate; and a sealing plate that seals the second concave portion, and configures a portion of a wall face of the flow path, on one face of the silicon substrate, wherein the first concave portion and the second concave portion overlap each other in an in-plane direction when seen in a direction which is orthogonal to the face of the silicon substrate, a stepped concave portion which accommodates the sealing plate, and of which a depth is larger than a thickness of the sealing plate, is provided on one face of the silicon substrate, and the second concave portion is placed on an inside of the stepped concave portion.
地址 JP