发明名称 |
METHOD FOR MAKING ELECTRONIC DEVICE WITH COVER LAYER WITH OPENINGS AND RELATED DEVICES |
摘要 |
A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a cover layer on the substrate and the electrically conductive pattern, and forming openings in the cover layer and being aligned with the electrically conductive pattern. The method also includes positioning an IC on the cover layer so that bond pads of the IC are aligned with the openings, and heating under pressure the cover layer to both mechanically secure and electrically interconnect the IC. |
申请公布号 |
US2016174371(A1) |
申请公布日期 |
2016.06.16 |
申请号 |
US201615049363 |
申请日期 |
2016.02.22 |
申请人 |
HARRIS CORPORATION |
发明人 |
RENDEK, JR. LOUIS JOSEPH;KERBY TRAVIS L.;RODRIGUEZ CASEY PHILIP;WEATHERSPOON MICHAEL RAYMOND |
分类号 |
H05K1/11;H05K1/09;H05K1/18;H05K1/03 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Melbourne FL US |