发明名称 First and second differential interconnects having interleaved stub traces
摘要 This disclosure relates generally to an electronic assembly and method having a first electrical connection point and a second electrical connection point and a differential interconnect coupling the first electrical connection point to the second electrical connection point, the differential interconnect including first and second transmission traces including a interior edges and a exterior edges opposite the interior edges, the second interior edge facing the first interior edge, and stub traces, each stub trace coupled to one of the first and second transmission traces and projecting from one of the first interior edge, the first exterior edge, the second interior edge, and the second exterior edge. A substantially equal number of stub traces project from the first exterior edge and the second exterior edge. At least twice as many stub traces project from the first and second exterior edges as project from the first and second interior edges.
申请公布号 US9386690(B2) 申请公布日期 2016.07.05
申请号 US201414228002 申请日期 2014.03.27
申请人 Intel Corporation 发明人 Ding Ruihua;Wang Min;Liu Mo
分类号 H05K1/02;H01P3/04;H04B3/32;H05K3/10;H01P3/02;H01P1/203 主分类号 H05K1/02
代理机构 Schwegman Lundberg & Woessner, P.A. 代理人 Schwegman Lundberg & Woessner, P.A.
主权项 1. An electronic assembly, comprising: a first electrical connection point and a second electrical connection point; and a first differential interconnect coupling the first electrical connection point to the second electrical connection point, the first differential interconnect including: a first transmission trace including a first interior edge and a first exterior edge opposite the first interior edge;a second transmission trace substantially parallel with the first transmission trace and including a second interior edge and a second exterior edge opposite the second interior edge, the second interior edge facing the first interior edge; andfirst stub traces, respective ones of the first stub traces coupled to corresponding one of the first transmission trace and the second transmission trace and projecting from corresponding one of the first interior edge, the first exterior edge, the second interior edge, and the second exterior edge, wherein a substantially equal number of first stub traces project from the first exterior edge and the second exterior edge, and wherein at least twice as many first stub traces project from the first and second exterior edges as project from the first and second interior edges; and a second differential interconnect substantially parallel, at least in part, with the first differential interconnect, wherein second stub traces of the second differential interconnect are interleaved with the first stub traces of the first differential interconnect.
地址 Santa Clara CA US