| 摘要 |
PROBLEM TO BE SOLVED: To achieve an electronic device excellent in performance and reliability, by enhancing heat dissipation of electronic components.SOLUTION: An electronic device 1 includes an electronic component 10, an electronic component 20 provided thereon, and a heat dissipation member 30 provided further thereon. The electronic device 1 further includes a conductor layer 40 provided continuously to an upper surface 20a and a lower surface 20b and the opposite side faces 20c, 20d of the electronic component 20, and connected with the electronic component 10 and the heat dissipation member 30. Overheating of the electronic component 20 is suppressed by heat transmission of the electronic components 20, 10 and heat dissipation member 30 via the conductor layer 40, and heat radiation from the conductor layer 40, thus suppressing performance degradation or failure of the electronic device 1 due to heat.SELECTED DRAWING: Figure 1 |
