SUBSTRATE UNIT

摘要

To provide a substrate unit which is capable of increasing the heat dissipation efficiency, while preventing deterioration of assembling workability. A substrate unit 1 which is provided with: a substrate 10 which is provided with a conductive pattern on one surface 10a, while being provided with an opening 11; a conductive member 20 which has a main body 21 affixed to the other surface 11b of the substrate, and to which some terminals of an electronic component 30 are electrically connected through the opening 11 formed in the substrate 10; and a heat dissipation member 40 which is affixed to a surface of the conductive member 20, said surface being on the reverse side of the substrate 10-side surface. An extended part 22, which extends from the main body 21 of the conductive member 20 and to which an external device is electrically connected, is provided so as to intersect with a plane P that extends along the heat dissipation member 40.