| 发明名称 |
SEMICONDUCTOR MEMORY DEVICE |
| 摘要 |
According to an embodiment of the present invention, a semiconductor memory device includes a substrate, a connector, a controller, a plurality of first capacitors, and a plurality of first memory packages. The connector is disposed at a first side of the substrate. The controller is mounted on a first face of the substrate and is disposed near the connector. The first capacitors are mounted on the first face of the substrate and are disposed along a second side opposing the first side. Each of the first memory packages includes a non-volatile semiconductor memory. The first memory packages are mounted on a second face of the substrate. |
| 申请公布号 |
US2016254031(A1) |
申请公布日期 |
2016.09.01 |
| 申请号 |
US201514842028 |
申请日期 |
2015.09.01 |
| 申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
NOGUCHI Kazuyuki;SAKAI Yoshimichi |
| 分类号 |
G11C5/02;G11C5/14;G11C14/00 |
主分类号 |
G11C5/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor memory device comprising:
a substrate; a connector disposed at a first side of the substrate; a controller mounted on a first face of the substrate and disposed near the connector; a plurality of first capacitors mounted on the first face of the substrate and disposed along a second side opposing the first side; and a plurality of first memory packages mounted on a second face of the substrate, each of the memory packages including a non-volatile semiconductor memory. |
| 地址 |
Minato-ku JP |
