| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing thermal stress applied to plate wiring.SOLUTION: In a semiconductor device, an in-corner part of plate wiring 34 has a beveled part K1 for alleviating stress at the in-corner part. The beveled part K1 alleviates stress at the in-corner part compared with a case where an in-corner part of the plate wiring 34 is set at 90 degrees at the time of pattern designing.SELECTED DRAWING: Figure 3 |
