发明名称 Liquid temperature control cooling
摘要 Examples of the present disclosure may include methods and systems for liquid temperature control cooling. An example of a liquid temperature control cooling system for an electronics rack (100, 200a, 200b) can include a number of electronic devices (102, 202) in the electronics rack (100, 200a, 200b), a panel (108-1, 108-2, 208-1, 224-1, 224-2) that extends from a roof (226) to a floor (228) inside the electronics rack (100, 200a, 200b), where a face of the panel (108-1, 108-2, 208-1, 224-1, 224-2) is parallel to a direction in which the number of electronic devices (100, 200a, 200b) slide into the electronics rack (100, 200a, 200b) and perpendicular to a front of the electronics rack, and a heat receiving structure (112, 212, 312, 412) that is integrated into the panel (108-1, 108-2, 208-1, 224-1, 224-2) and that is thermally coupled to the number of electronic devices (102, 202) through the panel (108-1, 108-2, 208-1, 224-1, 224-2), where the heat receiving structure (112, 212, 312, 412) can include a liquid flow compartment (330, 442) an input (216, 316, 416) to receive cool liquid into the liquid flow compartment (330, 442), and a control valve (214, 314, 414-1, 414-2, 414-3, 414-4) to release warm liquid from the liquid flow compartment (330, 442).
申请公布号 US9529395(B2) 申请公布日期 2016.12.27
申请号 US201214376138 申请日期 2012.03.12
申请人 Hewlett Packard Enterprise Development LP 发明人 Franz John P.;Sabotta Michael L.;Cader Tahir;Moore David A.
分类号 G06F1/20;H05K7/20;F28D15/02 主分类号 G06F1/20
代理机构 Brooks, Cameron & Huebsch, PLLC 代理人 Brooks, Cameron & Huebsch, PLLC
主权项 1. A liquid temperature control cooling system for an electronics rack, comprising: a number of electronic devices in the electronics rack; a panel that extends from a roof to a floor inside the electronics rack, wherein a face of the panel is parallel to a direction in which the number of electronic devices slide into the electronics rack and perpendicular to a front of the electronics rack; and a heat receiving structure that is integrated into the panel and that is thermally coupled to the number of electronic devices through the panel, wherein the heat receiving structure includes: a liquid flow compartment;an input to receive cool liquid into the liquid flow compartment; andat least one flow control valve to change a release rate of warm liquid from the liquid flow compartment at least partially in response to a temperature of the warm liquid flowing through the at least one flow control valve.
地址 Houston TX US