PREFORM COMPOSITE SOLDER,申请号JP19930145698-传众专利搜索

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发明名称	PREFORM COMPOSITE SOLDER
摘要
申请公布号	JPH06328289(A)	申请公布日期	1994.11.29
申请号	JP19930145698	申请日期	1993.05.25
申请人	MITSUBISHI MATERIALS CORP	发明人	OOMURA TOSHIMASA;YOSHIDA HIDEAKI
分类号	B23K35/14;B23K35/40;H05K3/34;(IPC1-7):B23K35/14	主分类号	B23K35/14
代理机构		代理人
主权项
地址

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