Polishing method and polishing device using the same

摘要

A polishing method and apparatus for a silicon substrate or the like, the method including disposing a polishing cloth in contact with a surface of a work to be polished, pressing the polishing cloth using pressing rods against the surface of the work to be polished in a region with a smaller area than the area of the surface of the work to be polished while adjusting the pressure of contact, and polishing the entire surface to be polished while moving the work relative to the polishing cloth and putting it under circulating movement with a radius smaller than a diametrical length of the region along the surface to be polished without autorotation.