| 摘要 |
PURPOSE: The apparatus is to improve control and uniformity of polishing speed by applying uniform pressure to a polishing surface of wafer only by internal pressure of fluid drum without separate pressing member and changing variably contacting surface of the fluid drum to adjust/set a distance between the surface of wafer and a center of the fluid drum. Also, it can realize high precision polishing operation and improve polishing state of the surface of the wafer. CONSTITUTION: The apparatus comprises a holder(18) arranged on one side of a frame(12), a pulley(26) of a rotating motor(28) connected to a lower pulley(24) for rotating the holder, a forward and backward rotatable motor(50) a connecting ball screw(48) to the frame to rotate in association with it, a guide plate(54) extending to move in association with and along a position-movable member, bracket(60) formed on outer surface of the guide plate, a rigid drum(66) rotating about a rotating shaft and having a polishing pad(68) on its outer surface, a support(72) including therein bearing for engaging outer surface area of both side ends of the rotating shaft, a pressing member fixed on top surface of the bracket and a pressing shaft for pressing the pressing member downwards. In this apparatus, a fluid drum engaged for rotating about a rotating shaft(90), a stopper screw(112) which extends perpendicular to the guide plate corresponding to both side support of the rotating shaft, a stopper(114) which adjusts a distance between the fluid drum and a wafer(14).
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