发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT AND WAFER
摘要 PROBLEM TO BE SOLVED: To enhance the operating speed of a semiconductor integrated circuit by forming the semiconductor integrated circuit on a substrate having a com pound semiconductor layer on an embedded insulation layer. SOLUTION: On a Si substrate 2 an embedded insulation layer 3 is formed, a Si epitaxial layer 4 is formed on the insulation layer 3, a single-crystal compd. semiconductor layer 5 is formed on the single-crystal Si epitaxial layer 4, whereby the Si substrate 2, the embedded insulation layer 3, the Si epitaxial layer 4 and the single-crystal compound semiconductor layer 5 form a semiconductor substrate 1, and transistors 21 are formed as active elements on the substrate 1, using the semiconductor layer 5. Thus since the operating speed of the active elements 21 on the semiconductor layer 5 is improved, it is possible to improve the operating speed of the semiconductor integrated circuit.
申请公布号 JP2000183179(A) 申请公布日期 2000.06.30
申请号 JP19980359349 申请日期 1998.12.17
申请人 MITSUBISHI ELECTRIC CORP 发明人 MATSUKAWA KAZUTO
分类号 H01L27/088;H01L21/8234;H01L29/786;(IPC1-7):H01L21/823 主分类号 H01L27/088
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