| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip inductor which can employ various sorts of substrate materials and have a high end electrode mounting strength and superior processing workability and cost. SOLUTION: In the manufacturing a chip inductor, a copper foil of a copper foil laminated substrate 1 is patterned to form an external electrode 2 as an end electrode and an extraction electrode 3, and a conductive ultra-thin film 6 is formed on an insulating layer 4 provided on the entire surface of the substrate, except for a contact region on the end electrode. The n resist is formed on a region on the film 6 other than the conductor pattern, a conductor layer 8 is formed by through electroplating on the conductor pattern, the resist is stripped off, and at the same time, the ultra-thin film 6 provided thereunder is also removed to form a conductor pattern. Since the end electrode is formed prior to the formation of an element, its mounting strength can be made high. Since vacuum coating is not adopted, its processing workability can be improved, the processing cost can be suppressed and at the same time also various types of substrate materials can be used/.
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