Transfer sheet and wiring board using the same, and method of manufacturing the same

摘要

A transfer sheet (100) of the present invention includes a resin film (101) having a glass transition temperature of not lower than 60°C, a silicone resin layer (103) formed on the resin film (101), and a metal wiring pattern (104) formed on the silicone resin layer (103). The metal wiring pattern (104) has an exposed face that forms a roughened face, and the roughened face has a ten-point average surface roughness (Rz) of 2 µm or more, while a face of the wiring pattern, which is in contact with the silicone resin layer (103), has a surface roughness (Rz) lower than that of the exposed face. Thereby, the present invention provides a transfer sheet that has improved transfer performance for enabling transferring at low temperature, and improved dimensional stability and also a via-connection reliability. The present invention provides also a wiring board using the transfer sheet and a method of manufacturing the same.