Electric conductive heat dissipation substrate

摘要

An electric conduction heat dissipation substrate includes a ceramic substrate, and a seed layer, and a buffering material layer and a copper circuit layer formed thereon in order. The buffering material layer has a coefficient of thermal expansion between those of the ceramic substrate and the copper circuit layer. Moreover, the buffering material layer is composed of alloy material and ceramic material or composed of metal material and ceramic material.

主权项

1. An electric conductive heat dissipation substrate, comprising:
a ceramic substrate; a seed layer, on the ceramic substrate, wherein the seed layer is one selected from the group consisting of nickel-phosphorous alloy, nickel-boron alloy, nickel-tungsten-phosphorous alloy, nickel-molybdenum-phosphorous alloy, nickel-tungsten-boron alloy, nickel-molybdenum-boron alloy, cobalt-phosphorous alloy, cobalt-boron alloy, cobalt-tungsten-phosphorous alloy, cobalt-molybdenum-phosphorous alloy, cobalt-tungsten-boron alloy and cobalt-molybdenum-boron alloy, or a mixture thereof; a buffering material layer, formed on the seed layer; and a copper circuit layer, on the buffering material layer, wherein a thermal expansion coefficient of the buffering material layer is between those of the ceramic substrate and the copper circuit layer, and the buffering material layer is composed of a metal material and a ceramic material, or is composed of an alloy material and the ceramic material.