发明名称 |
Epitaxial structures |
摘要 |
An embodiment is a method. A first III-V compound semiconductor is epitaxially grown in a trench on a substrate, and the epitaxial growth is performed in a chamber. The first III-V compound semiconductor has a first surface comprising a facet. After the epitaxial growth, the first surface of the first III-V compound semiconductor is etched to form an altered surface of the first III-V compound semiconductor. Etching the first surface is performed in the chamber in situ. A second III-V compound semiconductor is epitaxially grown on the altered surface of the first III-V compound semiconductor. The epitaxial growth of the first III-V compound semiconductor may be performed in a MOCVD chamber, and the etch may use an HCl gas. Structures resulting from methods are also disclosed. |
申请公布号 |
US9397169(B2) |
申请公布日期 |
2016.07.19 |
申请号 |
US201514668705 |
申请日期 |
2015.03.25 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chen Meng-Ku;Lin Hung-Ta;Tsai Pang-Yen;Chang Huicheng |
分类号 |
H01L29/00;H01L29/205;H01L29/06;H01L21/762;H01L29/78 |
主分类号 |
H01L29/00 |
代理机构 |
Slater Matsil, LLP |
代理人 |
Slater Matsil, LLP |
主权项 |
1. A structure comprising:
a (100) substrate comprising a trench, the trench being defined at least in part by a first isolation region on the substrate; a first III-V compound crystalline semiconductor in the trench, the first III-V compound crystalline semiconductor comprising a (113) surface distal from the substrate; and a second III-V compound crystalline semiconductor on the (113) surface of the first III-V compound crystalline semiconductor. |
地址 |
Hsin-Chu TW |