发明名称 Epitaxial structures
摘要 An embodiment is a method. A first III-V compound semiconductor is epitaxially grown in a trench on a substrate, and the epitaxial growth is performed in a chamber. The first III-V compound semiconductor has a first surface comprising a facet. After the epitaxial growth, the first surface of the first III-V compound semiconductor is etched to form an altered surface of the first III-V compound semiconductor. Etching the first surface is performed in the chamber in situ. A second III-V compound semiconductor is epitaxially grown on the altered surface of the first III-V compound semiconductor. The epitaxial growth of the first III-V compound semiconductor may be performed in a MOCVD chamber, and the etch may use an HCl gas. Structures resulting from methods are also disclosed.
申请公布号 US9397169(B2) 申请公布日期 2016.07.19
申请号 US201514668705 申请日期 2015.03.25
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Chen Meng-Ku;Lin Hung-Ta;Tsai Pang-Yen;Chang Huicheng
分类号 H01L29/00;H01L29/205;H01L29/06;H01L21/762;H01L29/78 主分类号 H01L29/00
代理机构 Slater Matsil, LLP 代理人 Slater Matsil, LLP
主权项 1. A structure comprising: a (100) substrate comprising a trench, the trench being defined at least in part by a first isolation region on the substrate; a first III-V compound crystalline semiconductor in the trench, the first III-V compound crystalline semiconductor comprising a (113) surface distal from the substrate; and a second III-V compound crystalline semiconductor on the (113) surface of the first III-V compound crystalline semiconductor.
地址 Hsin-Chu TW