Wafer level camera module with molded housing and method of manufacturing

摘要

A disclosed method of manufacturing a camera module includes providing an optical assembly, providing an integrated circuit image capture device (ICD), fixing the optical assembly directly to the ICD, then forming a housing directly over the optical assembly. The method further includes forming the housing over the ICD and the optical assembly via transfer molding. The method further includes forming solder balls on the rear surface of the ICD so as to enable the camera module to be reflow soldered to a host device. In an alternative embodiment of the present invention, the method includes providing a second ICD, providing a second optical assembly, providing a housing substrate, fixing the first optical assembly over the first ICD, fixing the second optical assembly over the second ICD, and forming the housing substrate over both the first and second optical assemblies. The alternative method further includes separating the housing substrate in to a first portion formed over the first optical assembly and second portion formed over the second optical assembly, providing a second housing substrate, and forming the second housing substrate over the first and second portions.

主权项

1. A method for manufacturing a camera module, said method including:
providing an integrated circuit die having a top surface including an image sensor array for capturing an image, a bottom surface opposite said top surface, and a sidewall between said top surface and said bottom surface, said bottom surface having a peripheral portion; mounting a transparent substrate directly on and in contact with the image sensor array; providing an optical assembly; mounting said optical assembly directly to said top surface of said integrated circuit die; and; molding a unitary housing over said optical assembly and said integrated circuit die after said optical assembly is mounted to said integrated circuit die, said unitary housing contacting said sidewall and said peripheral portion of said bottom surface of said integrated circuit die, said molding including molding the unitary housing in direct contact with and covering at least a portion of a top of the optical assembly to define a light aperture above the optical assembly for light to pass through the aperture into the optical assembly and onto the image sensor.