Method of forming package-on-package (PoP) structure having a chip package with a plurality of dies attaching to first side of an interposer with a die formed thereon

摘要

A package-on-package (PoP) structure comprises a first package and a second package. The first package comprises a first die, a second die, and a core material. The core material has a first surface and a second surface. A first redistribution layer (RDL) is on the first surface, and a second RDL is on the second surface. The first die is disposed in the core material between the first surface and the second surface. The second die is coupled to one of the first RDL and the second RDL. The second package comprises a third die and an interposer. The interposer has a first side and a second side. The third die is coupled to the second side of the interposer. The first package is coupled to the second package by first electrical connectors coupled to the second side of the interposer and the first RDL.

主权项

1. A method comprising:
applying a first molding compound on a first die, first electrical connectors electrically coupled to the first die being exposed through and having respective surfaces co-planar with a first surface of the first molding compound; forming a first redistribution layer (RDL) on the first surface of the first molding compound, the first RDL on the first molding compound being electrically coupled to the first electrical connectors; forming a second RDL on a second surface of the first molding compound; attaching a second die to the first RDL on the first molding compound; and attaching second electrical connectors to the first RDL on the first molding compound and to a first side of an interposer, the interposer having a third die on the first side of the interposer.