| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for improving adhesion between a wiring circuit and a glass substrate in a glass substrate with a wiring circuit.SOLUTION: As a glass substrate used for producing a glass substrate with a wiring circuit comprising a wiring circuit, a glass substrate with a modified layer comprising as a modified layer a porous ceramic film or a porous glass film each having a thickness of 20 nm to 30 nm on the surface of the glass substrate, and the like are applied to achieve the above-mentioned object. A glass substrate with a conductive metal layer comprising a conductive metal layer on the surface of the modified layer of the glass substrate with a modified layer, a glass substrate with a wiring circuit and the like are provided.SELECTED DRAWING: Figure 1 |
