| 摘要 |
PROBLEM TO BE SOLVED: To suppress a supply amount of a coating liquid regardless of viscosity of the coating liquid when a substrate is coated with the coating liquid, and to uniformly coat the substrate with the coating liquid in a plane.SOLUTION: A method for coating a wafer with a coating liquid includes: a step of forming a first liquid film at the center of a wafer with a solvent, and forming a second annular liquid film thicker than the first liquid film at the outer periphery of the wafer with the solvent, respectively (step T1); a step of supplying the coating liquid to the center of the wafer while rotating the wafer at first rotation speed (step T2); and a step of diffusing the coating liquid over the wafer by rotating the wafer at second rotation speed higher than the first rotation speed while supplying the coating liquid (step T3).SELECTED DRAWING: Figure 6 |
