METHOD OF BEVEL PROCESSING OF PCB SUBSTRATE

摘要

According to an embodiment of the present invention, in a method to treat a bevel, provided is a unit substrate having a certain width, length, and thickness. The end part of the unit substrate includes first to third areas having an outline formed in a longitudinal direction. The edge part of the end part is cut and treated by moving in the longitudinal direction. At this time, one or more among the first to third areas have an outline which is not parallel to the other areas. The treating step performs cutting in a straight direction along the outline and in a diagonal direction with regard to the straight direction, and performs cutting continuously on the treatment route from the first area to the third area through the second area. The present invention aims to provide a method to more easily treat the bevel in accordance with the shape of an outline of a PCB. The method of the present invention comprises: a step of providing the unit substrate having the certain width, length, and thickness; and a step of cutting the edge part of the end part of the unit substrate.