发明名称 |
EMBEDDED COMPONENT SUBSTRATE AND SEMICONDUCTOR MODULE |
摘要 |
An embedded component substrate includes: a core layer; a first electrode provided on a top surface of the core layer with a first insulating layer therebetween; and a second electrode provided on a bottom surface of the core layer with a second insulating layer therebetween, wherein a cavity is formed in the embedded component substrate from a top surface thereof to expose the second insulating layer at a bottom of the cavity, wherein a placement region is defined on the bottom of the cavity, for accommodating an electronic component; and wherein the embedded component substrate further includes a pad electrode on a portion of the second insulating layer, exposed by the cavity, surrounding the placement region located on the bottom of the cavity, the pad electrode vertically protruding from a top surface of the exposed second insulating layer upwardly and being configured to electrically connect to the electronic component. |
申请公布号 |
US2016293537(A1) |
申请公布日期 |
2016.10.06 |
申请号 |
US201615078793 |
申请日期 |
2016.03.23 |
申请人 |
TAIYO YUDEN CO., LTD. |
发明人 |
SUGIYAMA Yuichi;MIYAZAKI Masashi;HATA Yutaka;KATAKAI Masashi |
分类号 |
H01L23/498;H01L21/56 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
1. An embedded component substrate, comprising:
a core layer; a first electrode provided on a top surface of the core layer with a first insulating layer interposed therebetween; and a second electrode provided on a bottom surface of the core layer with a second insulating layer interposed therebetween, wherein a cavity is formed in the embedded component substrate from a top surface thereof to expose the second insulating layer at a bottom of the cavity, wherein a placement region is defined on the bottom of the cavity, for accommodating an electronic component; and wherein the embedded component substrate further comprises a pad electrode on a portion of the second insulating layer, exposed by the cavity, surrounding the placement region located on the bottom of the cavity, the pad electrode vertically protruding from a top surface of the exposed second insulating layer upwardly and being configured to electrically connect to the electronic component. |
地址 |
Tokyo JP |