发明名称 Device And Method For Substrate Heating During Transport
摘要 A system for heating substrates while being transported between processing chambers is disclosed. The system comprises an array of light emitting diodes (LEDs) disposed in the transfer chamber. The LEDs may be GaN LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. A controller is in communication with the LEDs. The LEDs may be independently controllable, so that the LEDs that are disposed above the substrate as it is moved from one processing chamber to another are illuminated. In other words, the illumination of the LEDs and the movements of the substrate handling robot may be synchronized by the controller.
申请公布号 US2016293458(A1) 申请公布日期 2016.10.06
申请号 US201514679526 申请日期 2015.04.06
申请人 Varian Semiconductor Equipment Associates, Inc. 发明人 Schaller Jason M.;Evans Morgan D.;Moradian Ala;Vopat Robert Brent;Blahnik David;Weaver William T.
分类号 H01L21/67;F21K99/00;H01L21/677 主分类号 H01L21/67
代理机构 代理人
主权项 1. A substrate handling and heating system, comprising: a chamber housing, defining a chamber; a substrate handling robot disposed in the chamber; and a LED array, comprising a plurality of LEDs, disposed within the chamber, wherein the LED array is disposed between a top surface of the chamber housing and the substrate handling robot; wherein illumination of the LEDs in the LED array is dependent upon a path of a substrate traveling through the chamber.
地址 Gloucester MA US