发明名称 |
METHOD AND SYSTEM FOR CLEANSING WAFER IN CMP PROCESS OF SEMICONDUCTOR MANUFACTURING FABRICATION |
摘要 |
A method for cleaning a semiconductor wafer after a Chemical Mechanical Polishing (CMP) process is provided. The method includes providing the semiconductor wafer into a cleaning module. The method further includes cleaning the semiconductor wafer by rotating a cleaning brush assembly. The method also includes applying an agitated cleaning liquid to clean the cleaning brush assembly. |
申请公布号 |
US2016293402(A1) |
申请公布日期 |
2016.10.06 |
申请号 |
US201514674138 |
申请日期 |
2015.03.31 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd |
发明人 |
TIEN Chia-Ying;HSUEH Chia-Lin |
分类号 |
H01L21/02;H01L21/306;H01L21/67 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
1. A method for processing a semiconductor wafer, comprising:
providing the semiconductor wafer into a Chemical Mechanical Polishing (CMP) module; polishing the semiconductor wafer; removing the semiconductor wafer from the CMP module; cleaning the semiconductor wafer by a brush member surrounding a rotation shaft; supplying a cleaning liquid to an agitation transducer and agitating the cleaning liquid to an agitated cleaning liquid by the agitation transducer; supplying the agitated cleaning liquid along a predetermined path, wherein at least a section of the predetermined path is parallel to a rotation axis about which the rotation shaft rotates; and cleaning the brush member by using the agitated cleaning liquid. |
地址 |
Hsin-Chu TW |