High frequency band pass filter with coupled surface mount transition

摘要

A high frequency band pass filter with a coupled surface mount transition is provided, including a filter substrate, circuit connection elements defining input and an output elements provided on a surface of the filter substrate, electronic filter components provided on the first surface of the filter substrate, and impedance matching structures provided on the first surface of the filter substrate between the electronic filter components and the respective input and output elements. Signal connection structures are provided on an opposed surface of the filter substrate, in locations that positionally correspond to respective positions of the input and output elements. The respective signal connection elements are capacitively coupled, through a thickness direction of the filter substrate, to a respective one of the input and output elements on the opposed surface of the filter substrate without the presence of any vertical conductive structures within the filter substrate at the input and the output elements.

主权项

1. A high frequency band pass filter with a coupled surface mount transition, comprising:
a dielectric filter substrate having a first surface and an opposed second surface; circuit connection elements defining an input element and an output element provided on the first surface of the filter substrate and spaced a distance d from respective terminal edges of the first surface of the filter substrate; electronic filter components provided on the first surface of the filter substrate and extending along a longitudinal extension axis of the filter substrate from a first point proximate a first end of the filter substrate to a second point proximate a second end of the filter substrate; impedance matching structures provided on the first surface of the filter substrate and interposed between the input element and the electronic filter components and between the output element and the electronic filter components; at least one protrusion integrally connected to each impedance matching structure and extending to a position between the first and second points; and signal connection elements provided on the second surface of the filter substrate in locations that positionally correspond to respective positions of the input element and output element on the first surface of the filter substrate, the signal connection elements respectively separated from a ground plane on the second surface of the filter substrate by an electrically insulating isolation area, and being spaced a distance d2 from respective terminal edges of the second surface of the filter substrate; whereby the respective signal connection elements on the second surface of the filter substrate are capacitively coupled, through a thickness direction of the filter substrate, to a respective one of the input and output elements on the first surface of the filter substrate without the presence of any vertical conductive structures within the filter substrate at the circuit connection elements.