| 摘要 |
To suppress faulty connection between an electrode pad of a substrate and a bump of a semiconductor chip. A semiconductor device is provided with: a substrate having a plurality of electrode pads 15 disposed on one surface; a semiconductor chip 20 having substantially identically sized bumps formed on one surface; and an anisotropic electroconductive film 30 interposed between the bumps 21 and the electrode pads 15 so as to electrically connect the bumps 21 and the electrode pads 15. The electrode pads 15 include a plurality of first electrode pads 15A located at positions nearest to an edge 25 of the semiconductor chip 20 and a plurality of electrode pads 15B located further on the inside of the semiconductor chip 20 than the first electrode pads 15A. The area of each of the second electrode pads 15B is greater than the area of each of the first electrode pads 15A. |
