发明名称 Mobile communication device
摘要 A mobile communication device includes a substrate, a frame, a ground plane, and an antenna element. The substrate includes a first surface and a side wall. The frame includes a frame portion adjacent to the side wall. The ground plane is arranged on the first surface and includes a notch. An opening of the notch faces the frame portion. The antenna element includes a first radiation portion having a feeding point, a second radiation portion electrically connected to the ground plane, a third radiation portion electrically connected to the first radiation portion, and a fourth radiation portion electrically connected to the second radiation portion. Orthogonal projections of the first and second radiation portions on the first surface are located in the notch of the ground plane, and the third and fourth radiation portions are located on the frame portion or the side wall of the substrate.
申请公布号 US9521222(B1) 申请公布日期 2016.12.13
申请号 US201615057125 申请日期 2016.03.01
申请人 Acer Incorporated 发明人 Chiang Hsin-Wu;Wei Wan-Chu;Ma Pei-Chi;Chiu Pei-Yuan
分类号 H04M1/00;H04M1/02;H01Q1/24;H04W88/02 主分类号 H04M1/00
代理机构 Jianq Chyun IP Office 代理人 Jianq Chyun IP Office
主权项 1. A mobile communication device comprising: a substrate comprising a first surface and a side wall adjacent to the first surface; a frame comprising a frame portion adjacent to the side wall; a ground plane arranged on the first surface and comprising a notch, an opening of the notch facing the frame portion; and an antenna element comprising a first radiation portion having a feeding point, a second radiation portion electrically connected to the ground plane, a third radiation portion electrically connected to the first radiation portion, and a fourth radiation portion electrically connected to the second radiation portion, wherein orthogonal projections of the first radiation portion and the second radiation portion on the first surface are located in the notch of the ground plane, and the third radiation portion and the fourth radiation portion are located on the frame portion or the side wall of the substrate.
地址 New Taipei TW