| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a holding structure capable of suitably holding an object to be held, such as MEA modules or the like, while keeping sticking to holding plates and to provide an electronic apparatus using the same. <P>SOLUTION: A DMFC unit U1 is provided with an MEA module whose shape in a plan view is rectangular, a pair of holding plates 31 holding the MEA module, and bolts 41 holding the pair of holding plates 31 at outer positions of the MEA module in a plan view. The holding plate 31 is provided with slits 31b and 31b parallel to opposed short sides 11C<SB>1</SB>and 11C<SB>1</SB>of the MEA module, and longer than the short side in a position corresponding to an inner region 41A inside of the holding positions in order to reduce transmission of a stress generated between portions corresponding to the short sides 11C<SB>1</SB>and 11C<SB>1</SB>. <P>COPYRIGHT: (C)2007,JPO&INPIT |
