| 摘要 |
<p>A method of manufacturing a wiring board is provided to prevent warpage of the wiring board from being bent by uniformly applying the shrinkage on curing to upper and lower portions of an insulation layer. A wiring board includes an insulation layer(106) made of a build-up material, such as an epoxy. A semiconductor chip(110) is embedded in the insulation layer. First and second reinforcement layers(103,114) are formed on the insulation layer. The reinforcement layers are arranged to be inserted between the insulation layers. A stud bump(111) made of Au is formed on an electrode pad of the semiconductor chip. A wiring portion(108) is embedded inside the insulation layer. An underfill layer is formed at a lower portion of the semiconductor chip. Wiring portions(105,113,116) are formed on the wiring board. An electrode(102) connected to a via plug is connected to an aperture of the reinforcement layer. Solder resist layers(119,117) are formed to cover the reinforcement layer.</p> |
