| 摘要 |
PCT No. PCT/JP94/00551 Sec. 371 Date Mar. 13, 1995 Sec. 102(e) Date Mar. 13, 1995 PCT Filed Apr. 4, 1994 PCT Pub. No. WO94/24698 PCT Pub. Date Oct. 27, 1994A semiconductor chip is positioned over the device hole of a circuit board which includes an insulating flexible substrate. The electrode bumps of the semiconductor chip are bonded to the lead portions of the conductive pattern, which protrude into the device hole by using the single-point bonding method. The circuit board includes superimposing areas of the substrate that overlie the semiconductor chip at the four corner areas of the device hole, as well as the superimposing area that divides the device hole into the four holes. Dummy bumps are provided on the areas of the semiconductor chip that overlap these superimposing areas. The dummy bumps are not to be bonded to the conductive pattern and are positioned between the circuit board and the semiconductor chip to maintain a specified distance between the two. Furthermore, a through-hole is provided in the superimposing area to allow air to escape when a molding agent is injected through the holes. |
