发明名称 ELECTRONIC APPARATUS HOUSING AND ELECTRONIC APPARATUS HAVING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To radiate heat generated by a printed board assembly to the outside of an electronic apparatus, by causing a metal-platelike member having communi cating holes in its dome part and a columnar member fixed to the dome part to constitute a buried metal assembly. SOLUTION: Heat generated by a printed board assembly 61 is transmitted by a columnar brass member 34 shown by arrow A, is transmitted to a dome part 35 of aluminum, spreads in the dome 35, and is radiated into the atmosphere outside an electronic apparatus 30 from the underside 32a-1 of a bottom plate part 32a as shown by arrow B. Here the heat radiating route for the heat generated by a printed board assembly 61 is all composed of metal, and does not have any synthetic resin part in the middle. Accordingly, the thermal resistance of the heat radiating route is low, and the heat generated by the printed board assembly 61 is radiated efficiently. Besides, the printed board assembly 61 is finely fitted, since the columnar member 34 has been reinforced by a reinforcing part.</p>
申请公布号 JPH09214144(A) 申请公布日期 1997.08.15
申请号 JP19960018852 申请日期 1996.02.05
申请人 FUJITSU LTD 发明人 KURITA KATSUYUKI
分类号 H05K5/02;G06F1/20;H05K7/20;(IPC1-7):H05K5/02 主分类号 H05K5/02
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