摘要 |
A method of compliantly mounting piezoelectric device with a substrate. First, outer portions of a piezoelectric element are selectively metallized. Next, one layer of aluminum is selectively dispensed on the piezoelectric element. Third, an uncured conductive compliant material is placed and aligned on a substrate. Fourth, the piezoelectric element is placed and aligned on the conductive compliant material, such that upon curing the conductive compliant material forms a compliant mount connecting the outer metallized portions of the piezoelectric element with the substrate. |
申请人 |
MOTOROLA, INC., SCHAUMBURG, ILL., US |
发明人 |
ZIMNICKI, CHARLES, SCHAUMBURG, IL 60194, US;ALHAYEK, IYAD, SCHAUMBURG, IL 60193, US |