发明名称 VERFAHREN ZUM NACHGIEBIGEN ZUSAMMENBAU EINES PIEZOELEKTRISCHEN BAUELEMENTS
摘要 A method of compliantly mounting piezoelectric device with a substrate. First, outer portions of a piezoelectric element are selectively metallized. Next, one layer of aluminum is selectively dispensed on the piezoelectric element. Third, an uncured conductive compliant material is placed and aligned on a substrate. Fourth, the piezoelectric element is placed and aligned on the conductive compliant material, such that upon curing the conductive compliant material forms a compliant mount connecting the outer metallized portions of the piezoelectric element with the substrate.
申请公布号 DE69418319(D1) 申请公布日期 1999.06.10
申请号 DE1994618319 申请日期 1994.11.22
申请人 MOTOROLA, INC., SCHAUMBURG, ILL., US 发明人 ZIMNICKI, CHARLES, SCHAUMBURG, IL 60194, US;ALHAYEK, IYAD, SCHAUMBURG, IL 60193, US
分类号 H01L41/04;H01L41/22;H03H3/007;H03H3/02;H03H9/05;H03H9/09;(IPC1-7):H01L41/22;H01L41/08 主分类号 H01L41/04
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