Halbleiter-Schmelzsicherungstrukturen

摘要

An improved fuse structure placed within an integrated circuit is provided. The fuse structure comprises a filament (18) extending over a raised or thickened insulating surface (14). When the filament is programmed or blown, the raised or thickened underlayer ensures the filament is blown at a select location near the sloped sidewall of the underlayer, and further ensures a clean separation of the filament and that the filament is less likely to regrow after it is blown. Various types of underlayer structures can be used to provide a filament extending in an elongated arcuate path which is raised above and thermally isolated from the substrate.