发明名称 COMPOSITIONS, METHODS AND DEVICES FOR HIGH TEMPERATURE LEAD-FREE SOLDER
摘要 A lead-free solder (130) comprises an alloy that includes Ag in an amount of 2 wt % to 18 wt %, Bi in an amount of 98 wt % to 82 wt %, and a third element in an amount of 0.1 wt % to 5.0 wt %. The third element is selected from the group consisting of Au, Cu, Pt, Sb, Zn, In, Sn, Ni and Ge. Contemplated alloys have a solidus of no lower than 230°C and a liquidus of no higher than 400°C.
申请公布号 KR100700233(B1) 申请公布日期 2007.03.26
申请号 KR20037015491 申请日期 2003.11.27
申请人 发明人
分类号 C22C13/00;B23K35/00;B23K35/26;C22C5/02;C22C12/00;C22C13/02;H01L21/60 主分类号 C22C13/00
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