发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, LIBRARY USED FOR MANUFACTURE THEREOF, RECORDING MEDIUM, AND SEMICONDUCTOR MANUFACTURING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of semiconductor device for enabling high-speed and high-precision formation of patterns. <P>SOLUTION: Size-accuracy at the area near cell boundary can be acquired by completing single process for each cell through implementation of OPC after decomposition of layout data for each cell in the OPC processing step, and by executing OPC only to the cell boundary after arrangement of the OPC application cell of each cell on a chip. Moreover, OPC at the cell boundary can be simplified and executed quickly by uniformly shrinking the pattern on the cell boundary. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007080965(A) 申请公布日期 2007.03.29
申请号 JP20050264108 申请日期 2005.09.12
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KAMISHIRO MASAHIKO;TANIMOTO TADASHI
分类号 H01L21/027;G03F1/36;G03F1/68 主分类号 H01L21/027
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