发明名称 Method for manufacturing composite piezoelectric substrate
摘要 A method for manufacturing a composite piezoelectric substrate capable of forming an ultra-thin piezoelectric film includes preparing a piezoelectric substrate and a supporting substrate, implanting ions from a surface of the piezoelectric substrate to form a defective layer in a region of the piezoelectric substrate, removing impurities that are adhered to at least one of the surface of the piezoelectric substrate in which the defective layer is formed and a surface of the supporting substrate to directly expose the constituent atoms of the surfaces and to activate the surfaces, bonding the supporting substrate to the surface of the piezoelectric substrate to form a bonded substrate body, and separating the bonded substrate body at the defective layer formed in the piezoelectric substrate so that a separation layer between the surface of the piezoelectric substrate and the defective layer is separated from the piezoelectric substrate.
申请公布号 US9385301(B2) 申请公布日期 2016.07.05
申请号 US201314068007 申请日期 2013.10.31
申请人 Murata Manufacturing Co., Ltd. 发明人 Kando Hajime;Yoshii Yoshiharu
分类号 H01L41/27;H01L41/25;H01L41/187;H01L41/335;H01L41/337;H01L41/257;H01L41/312;H03H3/08;H03H3/02;G02F1/035 主分类号 H01L41/27
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A method for manufacturing a composite piezoelectric substrate comprising: a first step of preparing a piezoelectric substrate and a supporting substrate; a second step of implanting ions from a surface of the piezoelectric substrate to form a defective layer in a region at a predetermined depth from the surface of the piezoelectric substrate; a third step of bonding the supporting substrate to the surface of the piezoelectric substrate to form a substrate bonded body; a fourth step of separating the substrate bonded body at the defective layer formed in the piezoelectric substrate so that a separation layer between the surface of the piezoelectric substrate and the defective layer is separated from the piezoelectric substrate and bonded to the supporting substrate to form the composite piezoelectric substrate; a fifth step of smoothing the surface of the separation layer of the composite piezoelectric substrate; and a polarization step of polarizing the separation layer of the composite piezoelectric substrate after the second step and before the third step, or after the third step to correct polarization inversion of piezoelectric material in the separation layer.
地址 Kyoto JP