发明名称 |
Non-volatile memory device and method for fabricating the same |
摘要 |
A method for fabricating a non-volatile memory device includes: providing a substrate which includes a cell region where a plurality of memory cells are to be formed and a peripheral circuit region where a plurality of peripheral circuit devices are to be formed; forming the memory cells that are stacked perpendicularly to the substrate of the cell region; and forming a first conductive layer for forming a gate electrode of a selection transistor over the memory cells while forming the first conductive layer in the peripheral circuit region simultaneously, wherein the first conductive layer of the peripheral circuit region functions as a resistor body of at least one peripheral circuit device of the peripheral circuit devices. |
申请公布号 |
US9391166(B2) |
申请公布日期 |
2016.07.12 |
申请号 |
US201414584737 |
申请日期 |
2014.12.29 |
申请人 |
SK hynix Inc. |
发明人 |
Ahn Jung-Ryul |
分类号 |
H01L21/336;H01L29/66;H01L27/115;H01L29/792 |
主分类号 |
H01L21/336 |
代理机构 |
William Park & Associates Ltd. |
代理人 |
William Park & Associates Ltd. |
主权项 |
1. A method of fabricating a non-volatile memory device comprising a substrate having a cell region and a peripheral circuit region, the method comprising:
forming first gate electrodes of a plurality of memory cells that are stacked over the cell region of the substrate so that the first gate electrodes are arranged along a vertical direction; and forming a second gate electrode of a selection transistor over the first gate electrodes and forming a resistor body over the peripheral circuit region of the substrate at the same time, wherein the second gate electrode and the resistor body include a same material layer. |
地址 |
Icheon-si, Gyeonggi-do KR |